The fields of finite-element analysis, failure analysis, and solid mechanics all express stresses in terms of tensors. Engineering literature usually treats a tensor as a symbol dressed with indices ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
A team of Johns Hopkins researchers is using an innovative X-ray imaging approach to reveal how compression reshapes the tiny spaces and stresses within sandstone—findings that could predict how this ...
A Solar Cell Metrology Tool Manufacturer has added a new 3rd generation Zebra OptoProfiler G3 to its product and services family. The Zebra OptoProfiler is a user-friendly solution for topography and ...
https://doi.org/10.4007/annals.2018.188.2.4 https://www.jstor.org/stable/10.4007/annals.2018.188.2.4 We prove global existence of appropriate weak solutions for the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback