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SEOUL, South Korea, Jan. 18, 2018 /PRNewswire/ -- LG Innotek today announced that it had succeeded in developing an 'advanced flip chip LED package' that demonstrates high efficiency and high luminous ...

FREMONT, Calif., March 18, 2026 /PRNewswire/ -- Optoma Technology, a leader in cutting-edge visual solutions, is excited to expand the ProScene All-in-One (AIO) dvLED Flip-chip COB (Chip on Board) ...

Daktronics has released its Flip-Chip COB (Chip On Board) LED display technology. The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings ranging from ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

Japan-based Nichia has announced that the China National Intellectual Property Administration (CNIPA) has invalidated ZL20071016547.X, a China patent concerning LED flip-chip technology owned by ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...

Featuring advanced Flip-chip (COB) Chip on Board LED technology, Optoma's ProScene AIO dvLED Series delivers stunning, lifelike visuals producing 700 Nits of brightness and enhancing light efficiency ...