Dow highlights AI thermal management materials at Computex Taipei 2026—cooling fluids, TIMs & packaging for data centers.

DOW heads into COMPUTEX Taipei 2026 with next-gen AI thermal materials, designed to support scalable cooling, from chip ...

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Developing high-power electronic devices with their simultaneous miniaturization is of critical importance. Consequently, the compactness in computers calls for higher integration of transistors ...

Scientists have measured two fixed panels and two single-axis modules for months to determine their site-specific heat dissipation factors. These local results indicate a 3.3% enhancement in energy ...

Directional thermal diffusion and insulation of in-plane anisotropic carbon fiber/CNF nanocomposite films. In a new study, scientists from Japan designed flexible thermal diffusion films made of ...