A thermal expansion coefficient is a well-established key principle that all solid materials have different properties when exposed to variations in temperature. When they are exposed to high ...

In this interview, Venkat Nandivada Manager of Technical Sales at Master Bond Inc talks to AZoM about the tricky task of bonding two dissimilar substrates together. In your opinion, what is one of the ...

Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...

This article discusses bonding of substrates with different coefficients of thermal expansion (CTE) which is difficult in adhesive applications such as bonding aluminum to glass, glass to plastics, ...