Applied Materials (NASDAQ:AMAT) unveiled a suite of advanced semiconductor manufacturing systems to enhance the performance and efficiency of logic and memory chips that power artificial intelligence ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

The multi-function TinyLogic 74AUP family of devices have configurable logic gates that enable multiple logic functions from a single two-input device. The family of five ICs can do nine different ...

With US curbs biting, experts say near-memory computing and chip stacking could narrow the AI hardware gap with Nvidia China is stepping up its chip self-sufficiency push by combining relatively ...