Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
The funds will enable new technologies to be validated and transitioned at scale.
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.