A Reliable Low-latency Interconnect for Tightly-Coupled On-chip Communication” was published by researchers at ETH Zurich.

Morgan Stanley (May 14, 2025) predicted a humanoid robot market (let’s call this GPR: general-purpose robots) of $5 trillion ...

Researchers from La Trobe University, Deakin University, Monash University, and Swinburne University of Technology developed ...

New DRAM standard aims to solve a critical bottleneck.

Aware Fine-Tuning of Spiking Q-Networks on the SpiNNaker2 Neuromorphic Platform” was published by researchers at TU Dresden, ...

A focus on predictable and low-jitter performance will make Wi-Fi 8 appealing for ultra-high reliability applications.

XR goggles and puck devices Gaming is one of the first applications for extended reality (XR), virtual reality (VR), and ...

A new technical paper titled “In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current ...

A new technical paper titled “Thermal characteristics of a double intra-cavity contact VCSEL for cryogenic optical links” was ...

A Framework for Cross-Tool Virtual Prototyping” was published by researchers at RWTH Aachen University, MachineWare and ...

How AI is reshaping EDA, and how it will help chipmakers to focus on domain-specific solutions.

Abhi agreed. “We have to trust in that hallucination, that innovation to provide us with things that we’ve never seen before, ...