Tata Electronics and ASML Sign MoU for Dholera 300mm Semiconductor Chip Fab in Presence of PM Modi and Dutch PM ...
Kandou AI, a company focused on high-speed, energy-efficient connectivity and system solutions for artificial intelligence infrastructure, announced the closing of a $225 million strategic funding ...
Bourns, introduced four new multilayer chip inductor series: CE0603G, CE0603M, CE1005Q, and CE1608Q. The inductors feature a monolithic structure created through advanced multilayer technology. They ...
Intel to build a semiconductor assembly and test facility near Wrocław, Poland. Intel said it is establishing this plant to help European Union in achieving its goal of reclaiming 20% of global ...
Kyocera has announced it has completed the acquisition of all shares in NEC Toppan Circuit Solutions and the company has become a wholly-owned subsidiary. The new company name is KYOCERA Circuit ...
The Ministry of Electronics and Information Technology (MeitY) has approved 29 additional proposals under the Electronics Component Manufacturing Scheme (ECMS), following the earlier clearance of 46 ...
The new XJFlash from XJTAG allows you to automatically generate customized programming solution for the flash devices connected to FPGAs on your board. XJFlash automatically generate a custom design ...
Intel started volume production of finFET based 14nm semiconductor wafers. Intel's 14nm Core M processor architecture powered gadgets are going to hit the market during the Christmas and year-end ...
India is advancing its AI development in association with semiconductor and electronics sectors where a collaborative effort is the focus, linking AI progress closely to semiconductor capabilities. AI ...
Forte Design Systems is partnering with CircuitSutra to provide VLSI design services throughout India. Forte and CircuitSutra to co-develop ARM AMBA AXI and OCP-IP models compatible with Forte's ...
JEDEC Solid State Technology Association has published JESD84-B50: Embedded MultiMediaCard (e .MMC), Electrical Standard (5.0). e. MMC v5.0 defines several new functionalities and enhancements for ...
Semiconductor research organisation CEA-Leti presented a paper on how to Stack transistor sequentially in the same process flow for 3D-VLSI, at ongoing semiconductor manufacturing technology IEDM 2014 ...
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