Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced ...

The US Department of Commerce has signed four separate non-binding preliminary memoranda of terms to award more than $246 ...

GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...

The department announced Friday it had finalized a $93 million award to Infinera as part of the CHIPS and Science Act.

Summary The rise of advanced packaging in electronics brings both heightened security risks and opportunities. While dense systems introduce vulnerabilities during assembly and component integration, ...

Read here for analysis of Shin-Etsu Chemical's prospects in PVC and semiconductor markets, highlighting growth opportunities ...

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.