High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...

NVIDIA says TSMC's new $100 billion semiconductor fab investment will be the new 'foundational pillar' of new tech supply ...

Intel is making strides in its bid to become a true player in the contract chip manufacturing business. Sources familiar with ...

An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging.

SK hynix has reportedly achieved a yield of 70% for its next-gen HBM4 12-Hi memory, ready for NVIDIA's next-gen Rubin R100 AI GPUs coming soon.

TSMC has reportedly proposed a joint venture to operate Intel's foundry division, engaging companies like Nvidia, AMD, ...