It is no secret that Apple wants to own its hardware from start to end. This is why the company ditched Intel’s CPUs a few years ago and made its own series of Apple Silicon chips. The company is expected to debut the M5 chipset next year,

Apple's new M5 Pro, M5 Max, and M5 Ultra chips will reportedly use server-grade SoIC packaging, with the iPhone giant to use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, with separate CPU and GPU designs.

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage of TSMC's latest chip-packaging technology, known as SoIC-mH.

According to reliable Apple analyst Ming-Chi Kuo, in a Medium post on Monday, Apple will utilize "server-grade SoIC [System-on-Integrated-Chip] packaging" in its M5 Pro, M5 Max, and M5 Ultra chips, excluding only the base M5 chip.

Apple's high-end M5 chip variants might feature a new design that separates the CPU and GPU into server-grade chips.

Analyst Ming-Chi Kuo says that Apple will move away from its current processor designs that keep the CPU and GPU cores on the same chip — and see a performance gain.

A new report from Ming-Chi Kuo reveals some of the details on Apple's next-gen M5 chip, including some of the major changes coming.