Semiconductor Packaging News8d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News8d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News8d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News8d
Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...
Semiconductor Packaging News4d
Moore's Law at 60: get the Intel on the next few decades
Summary Intel's Sanjay Natarajan highlights Moore's Law's economic foundation & global influence. As physical limits loom, cutting-edge technologies like advanced packaging & Selective Layer Transfer ...
Semiconductor Packaging News3d
Moore’s Law at 60: get the Intel on the next few decades
Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...
Semiconductor Packaging News3d
What Google’s quantum computing breakthrough Willow means for the future of bitcoin and other cryptos
Google’s new quantum chip, Willow, achieves unprecedented speed and accuracy, completing tasks in minutes that would take supercomputers septillions of years. While its cryptographic risks remain ...
Semiconductor Packaging News3d
Samsung inks deal for US CHIPS funds
Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...
Semiconductor Packaging News3d
Arm vs. Qualcomm: Analyst Insights from Court Proceedings
The Arm vs. Qualcomm trial has concluded, with the jury now deliberating after closing arguments. TIRIAS Research analysts Jim McGregor and Francis Sideco share courtroom insights, analyzing the ...
Semiconductor Packaging News3d
WeEn Top Side Cooling SiC product introduction
WeEn Semiconductor has launched top-side-cooling (TSC) SiC devices, including Schottky diodes and MOSFETs in TSPAK and TOLT packages. TSC reduces thermal resistance ...
Semiconductor Packaging News4d
Arm vs. Qualcomm: Analyst Insights from Court Proceedings
Summary The Arm vs. Qualcomm trial has concluded with closing arguments, leaving the jury to deliberate. TIRIAS Research analysts Jim McGregor and Francis Sideco explore case insights and implications ...
Semiconductor Packaging News2d
Qualcomm defeats Arm's claim over chip design license breach
Summary Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek ...